Rocky Mountain E-Recovery specializes in the acquisition of premium IC grade silicon fallout, specifically from world leading suppliers of memory, flash, digital (DSP), asics, analog, discrete, EEproms, and wide variation of high quality silicon from IC producers.

Rocky has developed a specialized set of custom silicon surface removal process using high IC designed fab equipment redesigned and retrofitted to perform very unique, high volume, low cost, and high quality film/pattern surface removal from both whole and broken silicon. Automation applied to both whole and broken processes allows Rocky to process up to 4000 kgs of broken silicon per 24 hour period, using minimal operators and at lower costs than any known alternative providers in the world.

All silicon treatments are performed under strict EH&S compliance protocols. To receive the highest quality IC silicon in the world, Rocky is required to pass rigorous on site audits from the largest and most progressive device makers WW.

Current inventory of 8" and 12" whole wafers --- the majority being double side polished, 750um thickness, 11N purity, monocrystalline, > 1 ohm cm resistivity, is ~ as follows:

12": 80, 000 wafers
8" : 60, 000 wafers
6" : 40, 000 wafers
5" : 15, 000 wafers
2" : 50, 000 wafers

Broken silicon: 100% is IC grade ---- > 99% high resistivity

In addition to silicon, Rocky trades in various devices technology, with the privilege to purchase FLASH memory under allocation from the world leading supplier of flash. In addition, Rocky has possession of large volumes of blue tape of various device types.

Recent diversification has added new products to be sourced, including reclaim wafers, spare parts second source alternatives for AMAT parts, and myriad of other materials.

A growing program is the recycling and recovery of very precise levels of gold applied to specific IC devices that use this commodity layered in device topography. EXTREMELY unique to Rocky is the ability to remove Au at levels exceeding 95% efficiency, WHILE FULLY RECOVERING THE UNDERLYING WAFER SILICON.

Please contact Rick Matheson for any questions